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The purpose of this paper is to present results of the studies on modification of ethylene-vinyl acetate (EVA) encapsulation foil to be used as thermal interface material (TIM). It is estimated that poor thermal management in electronic devices can cause over 50 per cent of failures. As the junction temperature rises, the failure rate for electronics increases exponentially. To ensure sufficient heat transfer from its source, TIMs are used in various circuits. On the other hand, it is important to ensure high electric resistivity of the designed TIM.

The focus of the investigation was twofold: modification of EVA with both graphene oxide (GO) and silver nanopowder (nAg); and TIM applicability through lamination of photovoltaic cells with standard and modified EVA foil. The main problem of a new type of encapsulant is proper gas evacuation during the lamination process. For this reason, reference and modified samples were compared taking into account the percentage of gas bubbles in visible volume of laminated TIM. Finally, reference and modified TIM samples were compared using differential scanning calorimetry (DSC) and laser flash analysis (LFA) measurements.

The proper parameters of the lamination process for the modified EVA foil - with both GO and organometallic nAg particles - were selected. The nAg addition results in an increase in thermal conductivity of the proposed compositions with respect to unmodified EVA foil, which was confirmed by DSC and LFA measurements.

The experiments confirmed the potential application of both EVA foil as a matrix for TIM material and nAg with GO as an active agent. Proposed composition can bring additional support to a solar cell or other electronic components through effective heat removal, which increases its performance.